| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiator capable of improving heat dissipation efficiency, and also to provide a method of manufacturing the heat radiator, and a flexible circuit board equipped with the heat radiator.SOLUTION: A heat radiator includes: a first copper foil; a second copper foil; an adhesive layer installed between the first copper foil and the second copper foil; and working fluid. The first copper foil includes a first surface and a plurality of first grooves are provided on the first surface. The second copper foil includes a second surface, and on the second surface, a plurality of second grooves are provided correspondingly to the first grooves. The second copper foil is adhered to the first copper foil via the adhesive layer. The second grooves are communicated with the first grooves, respectively, and a plurality of sealed housing spaces are formed and the working fluid is housed in the housing spaces. |
