| 摘要 |
The invention describes a method for producing a material-bonding metal-ceramic soldered connection of an uncoated ceramic body (1) to a metal part (2, 3) by using a metallic solder (4), characterized by the steps of: choosing the metal part (2, 3) with a 50% fraction of an oxygen-affine element; choosing the ceramic body (1) with at least 80% aluminium oxide, zirconium oxide, silicon oxide or an alloy thereof; choosing an inactive, eutectic or near-eutectic solder (4); forming a structure with the ceramic body (1) and the metal part (2, 3) with an intermediate space between the surfaces thereof in relation to one another, wherein the solder is introduced into the vicinity of the intermediate space or into the intermediate space; introducing the structure into a furnace and applying a vacuum around the structure; heating the furnace to a soldering temperature (T) greater than the liquidus temperature (TL) of the solder (4); maintaining the soldering temperature for a soldering period (delta t). The invention also relates to such a connection and also to a ceramic bushing and to a high-temperature sensor with such a connection. |
