| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of carrying out polishing according to the distribution of the thickness of the film formed on the surface of the workpiece such as a semiconductor wafer and obtaining uniformity of the film thickness after polishing. SOLUTION: The polishing device for polishing a semiconductor wafer W, which is a workpiece, pressed against the polishing face of a polishing table 11 is provided with a dresser 39 for dressing the polishing face of the polishing table 11, a rocking motor 36 for moving the dresser 39 on the polishing face of the polishing table 11, a control device 50, which controls the speed of the motion of the dresser 39 caused by the rocking motor 36 according to the thickness of a film to be polished at a specified position in the region in the polishing face used for polishing a specified position in the polished face of the semiconductor wafer W. |
