发明名称 CAPACITANCE SENSOR, ACOUSTIC SENSOR, AND MICROPHONE
摘要 A capacitance sensor has a substrate, a vibration electrode plate formed over an upper side of the substrate, a back plate formed over the upper side of the substrate to cover the vibration electrode plate, and a fixed electrode plate arranged on the back plate facing the vibration electrode plate. At least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions. A sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed in each of the divided regions. The plurality of sensing units output a plurality of signals having different sensitivities. At least some sensing units of the sensing units have vibration electrode plates having areas different from the areas of the vibration electrode plates in the other sensing units.
申请公布号 US2015104048(A1) 申请公布日期 2015.04.16
申请号 US201314402246 申请日期 2013.05.22
申请人 OMRON Corporation 发明人 Uchida Yuki;Kasai Takashi
分类号 H04R23/00;G01H11/00;G01R27/26 主分类号 H04R23/00
代理机构 代理人
主权项 1. A capacitance sensor comprising: a substrate; a vibration electrode plate formed over an upper side of the substrate; a back plate formed over the upper side of the substrate to cover the vibration electrode plate; and a fixed electrode plate arranged on the back plate facing the vibration electrode plate, wherein at least one of the vibration electrode plate and the fixed electrode plate is divided into a plurality of regions, wherein a sensing unit configured by the vibration electrode plate and the fixed electrode plate is formed in each of the divided regions, wherein the plurality of sensing units output a plurality of signals having different sensitivities, wherein at least some sensing units of the sensing units have vibration electrode plates having areas different from the areas of the vibration electrode plates in the other sensing units, and wherein, of the sensing units, some sensing units having the vibration electrode plates having small areas have back plates in the regions of the corresponding sensing units having rigidity higher than rigidity of the back plates in the other sensing units having the vibration electrode plates having large areas.
地址 Kyoto-shi, Kyoto JP
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