发明名称 ETCHING METHOD, ETCHING DEVICE AND STORAGE MEDIUM
摘要 PROBLEM TO BE SOLVED: To perform etching of a wafer accurately while maintaining the elution component concentration in the etching liquid eluted from a wafer, without replacing the etching liquid entirely, within a predetermined certain range.SOLUTION: An etching method includes a plurality of etching steps, and an interval step between respective etching steps. Each etching step includes a first partial replacement pattern for discharging a first setting amount of the etching liquid used for etching, and supplying a second setting amount of new etching liquid. The interval step includes a second partial replacement pattern for discharging a third setting amount of the etching liquid used for etching, and supplying a fourth setting amount of new etching liquid.
申请公布号 JP2015070080(A) 申请公布日期 2015.04.13
申请号 JP20130202325 申请日期 2013.09.27
申请人 TOKYO ELECTRON LTD 发明人 FURUKAWA TAKAHIRO;NIMATA TAKESUKE;SATO HIDEAKI;HARA OUMI;KAWAZU TAKAHIRO;SHIOKAWA TOSHIYUKI;SATO TOSHIZO
分类号 H01L21/306 主分类号 H01L21/306
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