| 摘要 |
<p>Provided is a method for plating copper for depositing a copper plating layer which is uniform and flat and has excellent specular gloss (mirror gloss) even when a relatively thin copper plating layer is formed. The method for plating copper brings an article to be plated into contact with a pre-treated solution containing bromide compound ions and deposits copper by electroplating using a copper plating solution.</p> |
