| 发明名称 |
CONNECTOR PLACEMENT FOR A SUBSTRATE INTEGRATED WITH A TOROIDAL INDUCTOR |
| 摘要 |
A system includes a first connector coupled to a first surface of a substrate. The first connector enables the system to be electrically coupled to a first device external to the substrate. The system includes a second connector coupled to a second surface of the substrate. The system also includes a plurality of conductive vias extending through the substrate from the first surface to the second surface. The plurality of conductive vias surrounds the first connector and the second connector. The plurality of conductive vias is electrically coupled together to form a toroidal inductor. A first lead of the toroidal inductor is electrically coupled to the first connector. A second lead of the toroidal inductor is electrically coupled to the second connector. |
| 申请公布号 |
US2015092314(A1) |
申请公布日期 |
2015.04.02 |
| 申请号 |
US201314039192 |
申请日期 |
2013.09.27 |
| 申请人 |
QUALCOMM Incorporated |
发明人 |
Kim Daeik Daniel;Song Young Kyu;Velez Mario Francisco;Kim Jonghae;Yun Changhan Hobie;Zuo Chengjie;Zhang Xiaonan;Lane Ryan David;Nowak Matthew Michael |
| 分类号 |
H01F27/29;H01F41/04;H01F27/40 |
主分类号 |
H01F27/29 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A device comprising:
a substrate; a first connector coupled to a first surface of the substrate, the first connector configured to be electrically coupled to a first device external to the substrate; a second connector coupled to a second surface of the substrate; and a plurality of conductive vias extending through the substrate from the first surface to the second surface and surrounding the first connector and the second connector, wherein the plurality of conductive vias are electrically coupled together to form a toroidal inductor, wherein a first lead of the toroidal inductor is electrically coupled to the first connector, and wherein a second lead of the toroidal inductor is electrically coupled to the second connector. |
| 地址 |
San Diego CA US |
