| 发明名称 | Method for manufacturing electronic devices and electronic devices thereof | ||
| 摘要 | In some embodiments, a method of manufacturing electronic devices including providing a carrier substrate having a first side, a second side, and a first adhesive at the first side; providing a first flexible substrate; and bonding the first flexible substrate to the first side of the carrier substrate. The first adhesive bonds the first flexible substrate to the first side of the carrier substrate. The carrier substrate comprises a mechanism configured to compensate for a deformation of the carrier substrate. Other embodiments are disclosed. | ||
| 申请公布号 | US8992712(B2) | 申请公布日期 | 2015.03.31 |
| 申请号 | US201213683950 | 申请日期 | 2012.11.21 |
| 申请人 | Arizona Board of Regents, a Body Corporate of the State of Arizona Acting for and on Behalf of Arizona State University | 发明人 | Loy Douglas E.;Howard Emmett;Haq Jesmin;Munizza Nicholas |
| 分类号 | B29C65/48;B32B37/12;B32B38/10;B32B43/00;H01B13/00;H01L21/20;H01L21/683;H01L23/498;H01L27/12;H01L29/786;H01L51/00;B32B7/02;H01L51/05 | 主分类号 | B29C65/48 |
| 代理机构 | Bryan Cave LLP | 代理人 | Bryan Cave LLP |
| 主权项 | 1. A method of manufacturing electronic devices, the method comprising: providing a carrier substrate having a first side and a second side; providing a first flexible substrate; bonding the first flexible substrate to the first side of the carrier substrate with a first adhesive; and compensating for a deformation of the carrier substrate by coupling a mechanism to the second side of the carrier substrate, the deformation being caused by the bonding the first flexible substrate to the first side of the carrier substrate. | ||
| 地址 | Scottsdale AZ US | ||