Multi-layer input/output pad ring for solid state device controller

摘要

Some embodiments of the disclosed subject matter include an integrated circuit. The integrated circuit includes a solid state device controller configured to control a plurality of flash memory devices, a first set of input output IO pads, coupled to the solid state device controller, arranged as a first pad ring around a perimeter of the integrated circuit, and a second set of IO pads arranged adjacent to at least one side of the first pad ring, wherein one of the second set of IO pads includes a power source node configured to receive a power supply voltage for the solid state device controller, a ground node, and a bond pad configured to receive an external signal.

主权项

1. An integrated circuit comprising:
a solid state device controller configured to control a plurality of flash memory devices; a first set of input output IO pads, coupled to the solid state device controller, arranged as a first pad ring around a perimeter of the integrated circuit; and a second set of IO pads arranged adjacent to at least one side of the first pad ring, wherein one of the second set of IO pads comprises a power source node configured to receive a power supply voltage for the solid state device controller, a ground node, and a bond pad configured to receive an external signal.