发明名称 RESIN COMPOSITION AND HEAT RESISTANT RESIN COATING FILM USING THE SAME
摘要 <p>PROBLEM TO BE SOLVED: To provide a resin composition which does not generate an edge crown or foreign matter easily when a resin film thereof is formed for use as a surface protective film of a semiconductor element, an interlayer insulator film, and an insulator layer of an organic electroluminescent element.SOLUTION: Provided is a resin composition comprising (a) a polymer containing as a main ingredient a structural unit represented by formula (1) and/or a polyimide structural unit having hydroxyl groups on a bis(acid anhydride) residue or a diamine residue, (b) a solvent, and (c) an acrylic silicone graft polymer having polysiloxane branches. (In formula (1), Rrepresents a 2- to 8-valent organic group having 2 or more carbon atoms; Rrepresents a 2- to 8-valent organic group having 2 or more carbon atoms; R's each independently represent H or a C1 to C20 monovalent organic group; and p, q, and s are each independently an integer of 0 to 4, however p+q>0.)</p>
申请公布号 JP2015059152(A) 申请公布日期 2015.03.30
申请号 JP20130192734 申请日期 2013.09.18
申请人 TORAY IND INC 发明人 YANAGISAWA YASUSHI;MINAMIHASHI KATSUYA;KAMEMOTO SATOSHI
分类号 C08L79/04;C08G73/10;C08G73/22;C08K5/41;C08L43/04;C08L55/00 主分类号 C08L79/04
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