| 发明名称 |
ELECTROCONDUCTIVE INK COMPOSITION |
| 摘要 |
An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition, can form a circuit pattern on a polymer film with low heat resistance, and the obtained circuit pattern has excellent adhesion to a substrate and high conductivity. |
| 申请公布号 |
US2015083474(A1) |
申请公布日期 |
2015.03.26 |
| 申请号 |
US201314394766 |
申请日期 |
2013.04.15 |
| 申请人 |
DAISO CO., LTD. |
发明人 |
Kawamura Kensuke;Umakoshi Hideaki |
| 分类号 |
C09D11/52;H05K1/09 |
主分类号 |
C09D11/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electroconductive ink composition comprising silver particles (A), a compound having a siloxane backbone with a functional group (B), and an organic solvent (C), the silver particles (A) having a protective layer containing an amino group-containing compound and having a mean particle size of 1 nm or more and 100 nm or less, the content of the compound (B) being 4% by weight to 8% by weight based on the total amount of the composition. |
| 地址 |
Osaka JP |
