发明名称 FLEXIBLE ELECTRONIC FIBER-REINFORCED COMPOSITE MATERIALS
摘要 Flexible electronic substrate systems relating to providing a system for dimensionally-stable substrate systems to support electronic systems is provided.
申请公布号 US2015083473(A1) 申请公布日期 2015.03.26
申请号 US201414208107 申请日期 2014.03.13
申请人 CUBIC TECH CORPORATION 发明人 Downs Roland Joseph;Meldner Heiner W.;Adams Christopher Michael
分类号 H05K1/03;H05K1/09;H05K3/00;H05K3/06;H05K3/12;H05K3/02 主分类号 H05K1/03
代理机构 代理人
主权项 1. A composite material for electronic applications comprising: a. at least one conductive layer; and b. at least one laminate layer bonded to said conductive layer and comprising at least one unidirectional tape layer comprising monofilaments coated in an adhesive, all of said monofilaments lying in a predetermined direction within said tape, wherein said monofilaments have diameters less than 20 microns, and wherein spacing between individual monofilaments within an adjoining strengthening group of monofilaments is within a gap distance in the range between non-abutting monofilaments up to nine times the monofilament major diameter.
地址 MESA AZ US