| 主权项 |
1. A probe assembly to act as a temporary interconnect between terminals on an IC device and a test station, the probe assembly comprising:
a substrate comprising a dielectric material; a plurality of conductive stud bumps arranged on a first surface of the substrate in a configuration corresponding to the terminal on the IC device, the stud bumps comprising a shape adapted to temporarily couple with the terminals on the IC device; a plurality of conductive traces located on the substrate electrically coupled with the test station and proximal ends of one or more of the stud bumps; and a compliant layer supporting the proximal ends of the stud bumps, the compliant layer adapted to elastically bias the stud bumps toward the terminals on the circuit member and to compensate for non-planarity of the terminal. |
