发明名称 |
COMPOSITE SUBSTRATE MANUFACTURING METHOD, SEMICONDUCTOR ELEMENT MANUFACTURING METHOD, COMPOSITE SUBSTRATE, AND SEMICONDUCTOR ELEMENT |
摘要 |
Provided is a composite substrate manufacturing method, including at least: a first raw board deforming step of preparing a first substrate by deforming a first raw board having at least one surface as a minor surface into a state in which the minor surface warps outward; and a joining step of joining, after the first raw board deforming step, a protruding surface of the first substrate and one surface of a second substrate to each other, thereby manufacturing a composite substrate including the first substrate and the second substrate, in which the second substrate is any one substrate selected from a substrate having both surfaces as substantially flat surfaces and a substrate that warps so that a surface thereof to be joined to the first substrate warps outward. Also provided are a semiconductor element manufacturing method, a composite substrate and a semiconductor element manufactured. |
申请公布号 |
US2015076662(A1) |
申请公布日期 |
2015.03.19 |
申请号 |
US201314397400 |
申请日期 |
2013.04.24 |
申请人 |
NAMIKI SEIMITSU HOUSEKI KABUSHIKIKAISHA ;DISCO CORPORATION |
发明人 |
Aida Hideo;Aota Natsuko;Takeda Hidetoshi;Honjo Keiji;Hoshino Hitoshi;Ogasawara Mai |
分类号 |
H01L23/00;H01L21/02;H01L21/70 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
1. A composite substrate manufacturing method, comprising at least:
a first raw board deforming step of preparing a first substrate by deforming a first raw board having at least one surface as a minor surface into a state in which the minor surface warps outward; and a joining step of joining, after the first raw board deforming step, a protruding surface of the first substrate and one surface of a second substrate to each other, thereby manufacturing a composite substrate comprising the first substrate and the second substrate joined to the first substrate, wherein the second substrate is any one substrate selected from a substrate having both surfaces as substantially flat surfaces and a substrate that warps so that a surface thereof to be joined to the first substrate warps outward. |
地址 |
Adachi-ku, Tokyo JP |