SYSTEM AND METHOD FOR POSITIONING A SEMICONDUCTOR CHIP WITH A BOND HEAD, THERMAL BONDING SYSTEM AND METHOD

摘要

A system for positioning a semiconductor chip with a bond head includes a controller, first transporting means coupled to the controller and configured to hold and move the semiconductor chip to a first position, and second transporting means coupled to the controller and configured to receive the semiconductor chip at the first position and move the semiconductor chip to a second position to be picked up by the bond head. The first transporting means controllably corrects a position of the semiconductor chip such that the semiconductor chip is in a first alignment relative to the bond head at the first position. The second transporting means further controllably corrects the position of the semiconductor chip such that the semiconductor chip is in a second alignment relative to the bond head at the second position. A method for positioning a semiconductor chip with a bond head, and a thermal bonding system and method are also disclosed.