| 摘要 |
<p>A light emitting device package according to the embodiment of the present invention includes a package body which includes an upper side which includes a first segment and a second segment and has electrical conductivity, a light emitting device chip which is mounted on the first segment of the upper side of the package body and emits light of a wavelength band between 100nm and 400nm, and an electrical insulation part which includes a molding member which is arranged on the first segment of the upper side of the package body to surround the light emitting device chip, is arranged on the package body and includes a void. The electrical insulation part includes a first electrical insulation layer which is arranged on the second segment of the upper side of the package body and a second electrical insulation layer which is arranged on the lateral side of the package body.</p> |
