| 摘要 |
<p>A printed circuit board substrate having a metal post according to the present application includes a step of preparing a stack substrate which has a circuit line layer formed on an outer surface; a step of forming a register pattern to partly expose the surface of the circuit line layer on the stack substrate; a step of forming a metal layer for a post on the front surface of the stack substrate including the circuit line layer and the register pattern; a step of forming a mask pattern to selectively block the metal layer for a post in a region for forming a post; a step of forming a metal post by etching an exposed part of the metal post for a post by using the mask pattern as an etch mask; and a step of forming a solder mask pattern to cover part of the sidewall of the metal post and the circuit line layer.</p> |
