MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR MANUFACTURING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of detecting or predicting in real time, scratch or crack during grinding; and to provide a semiconductor manufacturing device.SOLUTION: A manufacturing method of a semiconductor device in an embodiment has steps of: detecting an elastic wave generated from a workpiece during grinding of the workpiece; and detecting or predicting an abnormality of the workpiece generated during grinding by analyzing the detected elastic wave.SELECTED DRAWING: Figure 1