SEMICONDUCTOR SEALING RESIN COMPOSITION AND SEMICONDUCTOR DEVICE INCLUDING CURED PRODUCT THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a resin composition capable of providing a cured product having less weight loss even when placed in a high temperature of 200°C or more for a long period, excellent adhesion to a CuLF or an Ag plating film, good mechanical strength in a high temperature and excellent reliability.SOLUTION: The resin composition comprises: (A) a cyanate ester compound having two or more cyanate groups in one molecule; (B) a phenolic compound represented by the following general formula (2); and (C) an inorganic filler. A molar ratio of a phenolic hydroxyl group in (B) the phenolic compound to a cyanate group in (A) the cyanate ester compound is 0.1-0.4.