EFEM

摘要

An EFEM 1 includes a wafer transfer chamber 3 having an interior space in which a wafer transfer robot 5 is disposed and load ports 2 disposed adjacent to a front surface 32 of the wafer transfer chamber 3, and semiconductor processing equipment M can be disposed adjacent to a rear surface 33 of the wafer transfer chamber 3. The EFEM 1 has a configuration in which two buffer stations 4 capable of temporarily storing wafers W are disposed next to each other in the front-rear direction A on a side surface 31 of the wafer transfer chamber 3. The EFEM 1 thus configured adapts to an increase in wafer diameter and is capable of handling many wafers while preventing or minimizing an increase in the stroke distance in the height direction of the wafer transfer robot 5 and an increase in the footprint of the entire EFEM 1.

主权项

1. An EFEM, equipment front end module, comprising:
a wafer transfer chamber having an interior space in which a wafer transfer robot is disposed; a load port disposed adjacent to a front surface of the wafer transfer chamber; and two buffer stations capable of temporarily storing wafers, wherein semiconductor processing equipment can be disposed adjacent to a rear surface of the wafer transfer chamber; and the two buffer stations are disposed next to each other in a front-rear direction of the wafer transfer chamber on at least one of both side surfaces of the wafer transfer chamber.