发明名称 Semiconductor device having passing gate and method for fabricating the same
摘要 A semiconductor device includes passing gates. In the semiconductor device, a passing gate formed in a device isolation film is vertically positioned at a deeper and lower level than an operation gate formed in an active region defined by the device isolation film such that the passing gate does not overlap with a junction region. A step difference is formed in a storage node junction region, and thus a contact area between a storage node contact and the storage node junction region is increased, resulting in the improvement of operational characteristics of the semiconductor device.
申请公布号 US8975140(B2) 申请公布日期 2015.03.10
申请号 US201414167849 申请日期 2014.01.29
申请人 SK Hynix Inc. 发明人 Chung Woo Young
分类号 H01L21/336;H01L29/78;H01L21/762 主分类号 H01L21/336
代理机构 代理人
主权项 1. A method for fabricating a semiconductor device, the method comprising: forming a device isolation film defining an active region in a substrate; forming an insulation film pattern defining a gate region over the active region and the device isolation film; forming trenches by etching the active region and the device isolation film using the insulation film pattern as an etch mask; forming a gate conductive film to fill the trenches as well as to be over the insulation film pattern; removing the gate conductive film formed over a passing gate region until the insulation film pattern is exposed, wherein the gate conductive film formed over an operation gate region is remained over the insulation film pattern; and etching the gate conductive film in a manner that an operation gate is positioned higher than a position of a passing gate.
地址 Icheon KR
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