Circuit board having a plated through hole passing through conductive pads on top and bottom sides of the board and the board

摘要

In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

主权项

1. An interconnectable circuit board, comprising:
a distal end having a first electrically conductive pad located on a top of the circuit board; a plated through hole on the conductive pad which passes through a first conductive layer of the circuit board, a second conductive layer of the circuit board, and an insulative layer of the circuit board disposed between the first conductive layer and the second conductive layer; a second electrically conductive pad located on a bottom of the circuit board, the second electrically conducutive pad coupled to the plated through hole; and a proximal end having a third electrically conductive pad attached to the top of the circuit board.