发明名称 A PRINTED CIRCUIT BOARD COMPRISING EMBEDED ELECTRONIC COMPONENT WITHIN AND A METHOD FOR MANUFACTURING
摘要 Disclosed herein is a printed circuit board (PCB) including an embedded electronic component, including: a core having a cavity; an electronic component inserted into the cavity having a rough surface formed on surfaces of external electrodes provided on both lateral portions thereof, a low rough surface being formed in a portion of the rough surfaces; insulating layers laminated on upper and lower portions of the core and bonded to an outer circumferential surface of the electronic component insertedly positioned in the cavity; and an external circuit pattern provided on the insulating layers.
申请公布号 KR101497192(B1) 申请公布日期 2015.02.27
申请号 KR20120155031 申请日期 2012.12.27
申请人 发明人
分类号 H05K1/18;H05K3/46 主分类号 H05K1/18
代理机构 代理人
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