| 发明名称 |
INSULATING RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD AND PRODUCTS MANUFACTURED BY USING THE SAME |
| 摘要 |
Disclosed herein are an insulating resin composition for a printed circuit board and products manufactured by using the same, and more particularly, an insulating resin composition for a printed circuit board including a 4-functional naphthalene-based epoxy resin and having improved coefficient of thermal expansion and glass transition temperature properties, and a prepreg and a printed circuit board as products manufactured by using the same. |
| 申请公布号 |
US2015057393(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201314095864 |
申请日期 |
2013.12.03 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Moon Jin Seok;Lee Hyun Jun;Yoo Seong Hyun;Kim Jin Young;Yun Geum Hee |
| 分类号 |
H05K1/03;H05K3/00 |
主分类号 |
H05K1/03 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An insulating resin composition for a printed circuit board comprising:
a liquid crystal oligomer (LCO); a 4-functional naphthalene-based epoxy resin; and a bismaleimide resin. |
| 地址 |
Suwon KR |
