| 发明名称 |
ON-CHIP VERTICAL THREE DIMENSIONAL MICROSTRIP LINE WITH CHARACTERISTIC IMPEDANCE TUNING TECHNIQUE AND DESIGN STRUCTURES |
| 摘要 |
A vertical three dimensional (3D) microstrip line structure for improved tunable characteristic impedance, methods of manufacturing the same and design structures are provided. More specifically, a method is provided that includes forming a first microstrip line structure within a back end of the line (BEOL) stack. The method further includes forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance. |
| 申请公布号 |
US2015054592(A1) |
申请公布日期 |
2015.02.26 |
| 申请号 |
US201313974804 |
申请日期 |
2013.08.23 |
| 申请人 |
University of South Carolina ;INTERNATIIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DEWITT Barbara S.;MINA Essam;RAHMAN BM Farid;WANG Guoan |
| 分类号 |
H01P3/08;H01L21/768;H01L23/66;G06F17/50 |
主分类号 |
H01P3/08 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
forming a first microstrip line structure within a back end of the line (BEOL) stack; and forming a second microstrip line structure separated from the BEOL stack by a predetermined horizontal distance. |
| 地址 |
Columbia SC US |
