MECHANICALLY ISOLATED THERMAL LINK

摘要

A thermal management arrangement for a device that includes a heat sink and an electronic component positioned on a substrate. The heat sink is positioned proximate to, but not in contact with the substrate and the thermal management arrangement includes a thermal link made of at least one sheet of flexible graphite. The sheet of flexible graphite is being in thermal contact with the electronic component and said heat sink. The thermal link includes a curved portion spanning a gap between the heat sink and the substrate or electronic component which is longer than required to bridge the gap to provide a slackened portion which reduces the transmission of mechanical energy between the heat sink and the substrate.