发明名称 Chip socket including a circular contact pattern
摘要 An apparatus for coupling an integrated circuit to other electronics can include a housing having an exterior and an interior, the exterior having an exterior bottom surface, the interior defined by an interior bottom surface opposite the exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall. The example can include a plurality of exterior contacts exposed along the exterior bottom surface in an exterior contact pattern that is generally circular in shape.
申请公布号 US8961193(B2) 申请公布日期 2015.02.24
申请号 US201213712166 申请日期 2012.12.12
申请人 Intel Corporation 发明人 Chawla Gaurav;Krithivasan Vijaykumar;Heppner Joshua D
分类号 H01R24/86 主分类号 H01R24/86
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. An apparatus for coupling an integrated circuit to other electronics, comprising: a housing having an exterior and an interior, the exterior having a substantially planar exterior bottom surface, the interior defined by an interior bottom surface opposite the substantially planar exterior bottom surface, and at least one sidewall extending away from the interior bottom surface to define an interior shape that is sized to receive the integrated circuit, with the integrated circuit disposed against the interior bottom surface and the at least one sidewall; a plurality of exterior contacts exposed along the substantially planar exterior bottom surface in an exterior contact pattern that is generally circular in shape; and a plurality of interior contacts, each in electrical communication with an exterior contact of the plurality of exterior contacts, with each of the plurality of interior contacts extending away from the interior bottom surface into the interior of the housing, exposed to the interior.
地址 Santa Clara CA US