| 摘要 |
PROBLEM TO BE SOLVED: To provide a low-cost semiconductor device having excellent heat dissipation performance.SOLUTION: The present invention relates to a semiconductor device comprising: a die pad 10; an input terminal 12; an output terminal 14; a resin substrate 20 which is mounted on the die pad 10 and has an opening 28 exposing a surface of the die pad 10; a semiconductor chip 22 mounted on the die pad 10 in the opening 28; an input wiring 36 and an output wiring 38 which are disposed on the resin substrate 20 and provided so as to sandwich the opening 28; a first wire 46a which electrically connects the semiconductor chip 22 to the input wiring 36 and to the output wiring 38 respectively; and a second wire 46b which electrically connects the input terminal 12 and the output terminal 14 to the input wiring 36 and the output wiring 38 respectively. |
