| 摘要 |
PROBLEM TO BE SOLVED: To fix a volume amount of an encapsulation material, to shorten an encapsulation time, to prevent contamination and to prevent a wire from being cut.SOLUTION: A manufacturing method of an LED lamp includes: a measuring step of measuring and supplying a liquid-state encapsulation material 11 by filling the inside of a recess 15 which is formed inside of a recess formation frame 13 of a square die 12 and of which the top face is opened; a moving step of disposing the square die 12 while vertically inverting it at an upper side of an LED chip 8 packaged on a packaging surface 6, moving a part of the liquid-state encapsulation material 11 within the recess 15 to the LED chip 8 by gravity, and moving the remaining part of the liquid-state encapsulation material 11 within the recess 15 to the LED chip 8 with electrostatic application; and a step of solidifying the liquid-state encapsulation material. |
