ADHESIVE FILM AND SEALING PRODUCT FOR ORGANIC ELECTRONIC DEVICE USING SAME

摘要

Provided are an adhesive film, and an organic electronic device (OED) encapsulation product using the same. Dimensional stability, lifespan, and durability may be enhanced even when a panel of an organic electronic device is large-sized and formed as a thin film by controlling dimensional tolerance and edge angular tolerance of the adhesive film, thereby ensuring long-term reliability, and process yields may be enhanced when the adhesive film is applied to an automation process.

主权项

1. An adhesive film encapsulating an organic electronic device OED, comprising:
a curable adhesive layer comprising a curable resin, wherein a dimensional tolerance (d) or edge angular tolerance (x) of the adhesive film satisfies Equation 1 or 2:
d=|df−di|<800 μmx=|xf−xi|<0.05 degrees  [Equation 1] where di is a length of a longer side or shorter side of the adhesive film at an optional i point, and df is a length of a longer side or shorter side of the adhesive film at a point of 2 weeks or more after the optional i point.