| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin composition for sealing excellent in electrolytic resistant deburring performance, soldering resistance and flame resistance, and a reliable electronic component device in which an element is sealed by the cured product of the composition. <P>SOLUTION: The resin composition for sealing includes: an epoxy resin (A) made of at least one polymer having a structure represented by a general formula (1) and containing at least either a polymer in which (b-1)/d>1 is satisfied in the general formula (1) or a polymer in which (b-1)/d<1 is satisfied; a phenol resin-based curing agent (B) containing at least one polymer having a structure represented by a general formula (2); and an inorganic filler (C). <P>COPYRIGHT: (C)2013,JPO&INPIT |
