| 摘要 |
<p>Disclosed are a support frame and a method for manufacturing a semiconductor package using the same. The method for manufacturing the semiconductor package according to the embodiment of the present invention includes the steps of: (a) preparing a support frame which includes a first through part, a second through part, and a conductive part which is formed between the first through part and the second through part; (b) arranging a semiconductor chip on the first through part to make an active surface of the semiconductor chip face downwards; (c) forming a molding layer to integrally mold the support frame and the semiconductor chip; and (d) forming a protection layer to partially or entirely cover the support frame. Wherein, a part of the protection layer passes through the second through part.</p> |
