发明名称 Thick film silver paste containing copper and lead—tellurium—oxide and its use in the manufacture of semiconductor devices
摘要 The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good electrical performance.
申请公布号 US8956557(B2) 申请公布日期 2015.02.17
申请号 US201313735602 申请日期 2013.01.07
申请人 E I du Pont de Nemours and Company 发明人 Rajendran Raj G.
分类号 H01B1/16;H01B1/22;H01L31/0224;H01L31/068 主分类号 H01B1/16
代理机构 代理人
主权项 1. A thick film silver paste comprising: (a) silver; (b) copper; (c) Pb—Te—O; and (d) organic medium;said thick film silver paste comprising 65-95 vol % silver and 5-35 vol % copper, wherein said vol % are based on the total volume of said silver and said copper and wherein said silver, said copper, and said Pb—Te—O are dispersed in said organic medium.
地址 Wilmington DE US