发明名称 |
Thick film silver paste containing copper and lead—tellurium—oxide and its use in the manufacture of semiconductor devices |
摘要 |
The present invention is directed to a thick film silver paste comprising (i) silver, (ii) copper, and (iii) a Pb—Te—O all dispersed in an organic medium. The present invention is further directed to an electrode formed from the paste and a semiconductor device and, in particular, a solar cell comprising such an electrode. The electrodes provide good electrical performance. |
申请公布号 |
US8956557(B2) |
申请公布日期 |
2015.02.17 |
申请号 |
US201313735602 |
申请日期 |
2013.01.07 |
申请人 |
E I du Pont de Nemours and Company |
发明人 |
Rajendran Raj G. |
分类号 |
H01B1/16;H01B1/22;H01L31/0224;H01L31/068 |
主分类号 |
H01B1/16 |
代理机构 |
|
代理人 |
|
主权项 |
1. A thick film silver paste comprising:
(a) silver; (b) copper; (c) Pb—Te—O; and (d) organic medium;said thick film silver paste comprising 65-95 vol % silver and 5-35 vol % copper, wherein said vol % are based on the total volume of said silver and said copper and wherein said silver, said copper, and said Pb—Te—O are dispersed in said organic medium. |
地址 |
Wilmington DE US |