Joined assembly, wafer holding assembly, attaching structure thereof and method for processing wafer

摘要

The object of the present invention is to provide an assembly, wafer holding assembly and attaching structure thereof, wherein sufficient air-tightness is assured during prolonged cycles of temperature rises and uninstallations and replacements of the assemblies are possible.;The joined assembly, according to the present invention, comprises a plate-shaped ceramic body; a ring-shaped member; and a hollow metal cylinder with one end thereof joined to the bottom surface of the plate-shaped ceramic body via a metal joint and the other end thereof joined to the ring-shaped member; wherein, the hollow metal cylinder having a shape to relax the stress caused by the differential thermal expansion between the plate-shaped ceramic body and the ring-shaped member.

主权项

1. A wafer holding assembly comprising a joined assembly comprising:
a plate-shaped ceramic body; a ring-shaped member; and a hollow metal body comprising a body portion and a flange, wherein the flange is not parallel to the body portion, wherein a first surface of the flange is joined to the bottom surface of the plate-shaped ceramic body and the body portion wherein a second surface of the flange is joined to a stress relief member, the stress relief member having an outer circumference and a tapered groove on the outer circumference; and wherein a differential in thermal expansion between the stress relief member and the plate-shaped ceramic body is 2×10−61° C. or less.