| 摘要 |
<p>The present invention relates to a heat dissipation system. The heat dissipation system includes a substrate unit and a sealing unit. The substrate unit having an end to be fixated on a connection unit is formed on a circuit unit, and is installed in the internal units. The sealing unit exposes the connection units to the outside, contains the internal units inside a containing space to be formed inside, is combined with the substrate unit to seal the containing unit, and fills cooling gas inside the containing space.</p> |
