| 摘要 |
PROBLEM TO BE SOLVED: To provide a light emitting device with improved light extraction efficiency.SOLUTION: A light emitting device 10 includes: a heat radiation substrate 11; a wiring substrate 12 which is bonded to the heat radiation substrate 11 to be fixed thereto, the wiring substrate 12 where a through hole 12a is formed; an LED chip 13 mounted on a surface of the heat radiation substrate 11 which is exposed from the through hole 12a of the wiring substrate 12; and a light reflection member 16 which coats an entire inner peripheral wall surface 12b of the through hole 12a of the wiring substrate 12. |
