PLASMA PROCESSING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a plasma processing apparatus capable of processing in high accuracy.SOLUTION: The plasma processing apparatus includes: plasma forming means (102, 115, 116, etc.); a mounting table 111 on which a wafer 110 is mounted; a bias power supply 117 for supplying the mounting table 111 with high frequency power; and a detector 108 for detecting a positive and a negative current amount flowing between the bias power supply 117 and the mounting table 111 and a current amount ratio thereof. According to the ratio, conditions for forming the plasma and plasma processing of the wafer 110 are adjusted.