发明名称 METHOD FOR MASS PRODUCTION OF MICROMETER GRADE GOLD WIRE
摘要 <p>PURPOSE: A gold bonding wire manufacturing method is provided to form precise and uniform gold bonding wires and prevent gold bonding wires sticking to each other. CONSTITUTION: A gold bonding wire manufacturing method is as follows. A plurality of holes are formed lengthwise in a quartz rod(10). The bottom of the quartz rod is sealed after inserting a plurality of gold wires(20) into the holes. The quartz rod with the gold wires inserted is mounted on a draw tower for optical fibre manufacture and heated to high temperature of 1750°C~2300°C. Wire samples(21a,21b,21c) of desired diameter are drawn out. A glass material is removed from the surface of the drawn wire samples so that gold bonding wires(22a,22b,22c) are completed.</p>
申请公布号 KR101493346(B1) 申请公布日期 2015.02.16
申请号 KR20080133528 申请日期 2008.12.24
申请人 发明人
分类号 B21C37/04;B23P17/06;C03B37/02 主分类号 B21C37/04
代理机构 代理人
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