| 发明名称 |
BONDING STRUCTURE OF ELECTRONIC EQUIPMENT |
| 摘要 |
Provided is a bonding structure of an electronic equipment including first electrodes extended in a first direction and arranged in a second direction on a stretchable display panel having stretchability, second electrodes extended in a first direction and arranged in a second direction on a substrate and facing the first electrodes, and solder bonding parts interposed between the first electrodes and the second electrodes, facing each other in the second direction, and constituting a plurality of rows in the first direction. |
| 申请公布号 |
US2015043175(A1) |
申请公布日期 |
2015.02.12 |
| 申请号 |
US201414218803 |
申请日期 |
2014.03.18 |
| 申请人 |
Electronics and Telecommunications Research Institute |
发明人 |
CHOI KWANG-SEONG;BAE Hyun-cheol;LEE Haksun;EOM Yong Sung |
| 分类号 |
H05K1/11 |
主分类号 |
H05K1/11 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonding structure of an electronic equipment, comprising:
first electrodes extending in a first direction and arranged in a second direction on a stretchable display panel; second electrodes extending in a first direction and arranged in a second direction on a substrate, the second electrodes facing the first electrodes; and solder bonding parts interposed between the first electrodes and the second electrodes, the solder bonding parts facing each other in the second direction and arranged to configure a plurality of rows in the first direction. |
| 地址 |
Daejeon KR |
