发明名称 |
CONDUCTIVE METAL ENHANCED WITH CONDUCTIVE NANOMATERIAL |
摘要 |
Electroplating systems and methods are provided that employ a structure for defining a zone of deposition for co-depositing metal and nanomaterial on a cathode. Materials that may be co-deposited include copper and carbon nanotubes Pulsed power may be employed to produce a more dimensionally uniform and/or more functionally uniform deposit. |
申请公布号 |
US2015041326(A1) |
申请公布日期 |
2015.02.12 |
申请号 |
US201213261851 |
申请日期 |
2012.11.15 |
申请人 |
Buckner Randall Reagan;Kissell Kyle;Horton Howard Scott;Gallaway Clayton Charles |
发明人 |
Buckner Randall Reagan;Kissell Kyle;Horton Howard Scott;Gallaway Clayton Charles |
分类号 |
C25D5/18;C25D5/02;C25D17/00 |
主分类号 |
C25D5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Houston TX US |