Method of bonding porous metal to metal substrates

摘要

A method for preparing an implant having a porous metal component. A loose powder mixture including a biocompatible metal powder and a spacing agent is prepared and compressed onto a metal base. After being compressed, the spacing agent is removed, thereby forming a compact including a porous metal structure pressed on the metal base. The compact is sintered, forming a subassembly, which is aligned with a metal substrate portion of an implant. A metallurgical bonding process, such as diffusion bonding, is performed at the interface of the subassembly and the metal substrate to form an implant having a porous metal component.

主权项

1. A method for preparing an implant having a porous metal component, comprising:
compressing a compact having a porous metal structure onto a metal base, the porous metal structure being formed from compressed powder particles and the metal base comprising a solid metal layer of material; sintering adjacent compressed powder particles of the porous metal structure to one another while concurrently sintering the porous metal structure to the metal base to form a subassembly; aligning the subassembly with a metal substrate component; and forming a metallurgical bond by maintaining a compressive force of between about 10 psi and about 30 psi along an interface between the metal base of the subassembly and the metal substrate component and diffusion bonding the solid metal layer of the metal base of the subassembly and the metal substrate component to form an implant.