摘要 |
FIELD: chemistry.SUBSTANCE: invention relates to composition based on polyamide resin for manufacturing moulded products. Composition contains polyamide, consisting of diamine units, containing units of 1,3-bis(aminomethyl)cyclohexane and units of dicarboxylic acid, including units of adipic and/or sebacic acid, (B) compounds of aromatic secondary amine, (C) organic sulphur-based compound and (D) phenolic oxidant. Weight ratio of components (B)/(C) in said composition constitutes from 0.5 to 10 and weigh ratio (D)/(C) in composition constitutes from 0.5 to 10. Polyamide resin-based composition is characterised by the fact that it has oxygen permeability coefficient not higher than 1.5 cubic cm·mm/mday·atm at temperature 23°C and relative humidity 75%. Moulded product, in particular hose or pipe is also described.EFFECT: increased resistance to thermal ageing with preservation of gas-barrier properties of polyamides and products manufactured from them.14 cl, 1 tbl, 16 ex |