发明名称 POLYAMIDE RESIN-BASED COMPOSITION AND MOULDED PRODUCT
摘要 FIELD: chemistry.SUBSTANCE: invention relates to composition based on polyamide resin for manufacturing moulded products. Composition contains polyamide, consisting of diamine units, containing units of 1,3-bis(aminomethyl)cyclohexane and units of dicarboxylic acid, including units of adipic and/or sebacic acid, (B) compounds of aromatic secondary amine, (C) organic sulphur-based compound and (D) phenolic oxidant. Weight ratio of components (B)/(C) in said composition constitutes from 0.5 to 10 and weigh ratio (D)/(C) in composition constitutes from 0.5 to 10. Polyamide resin-based composition is characterised by the fact that it has oxygen permeability coefficient not higher than 1.5 cubic cm·mm/mday·atm at temperature 23°C and relative humidity 75%. Moulded product, in particular hose or pipe is also described.EFFECT: increased resistance to thermal ageing with preservation of gas-barrier properties of polyamides and products manufactured from them.14 cl, 1 tbl, 16 ex
申请公布号 RU2540661(C2) 申请公布日期 2015.02.10
申请号 RU20110154160 申请日期 2010.06.08
申请人 MITSUBISI GEHS KEMIKAL KOMPANI, INK. 发明人 MITADERA DZUN;KUROKAVA MASASI
分类号 C08L77/06;C08K5/13;C08K5/18;C08K5/20;C08K5/36;F16L9/12;F16L11/00 主分类号 C08L77/06
代理机构 代理人
主权项
地址
您可能感兴趣的专利