SUBSTRATE MANUFACTURING FACILITY AND METHOD OF MANUFACTURING SUBSTRATE

摘要

A substrate manufacturing facility includes a lower molding plate and an upper molding plate. A resin supply tray provides resin powder to a top surface of the lower molding plate. The lower and upper molding plates may compress a substrate and the resin powder. The upper molding plate has multiple apertures. The apertures are densely formed on a front side of the upper molding plate. The front side of the upper molding plate contacts the substrate. The apertures have diameters smaller than diameters of the resin powder. The substrate manufacturing facility includes a vacuum pump, a ventilator, a conduit, a controller, and valves. The substrate manufacturing facility can adsorb a circuit board using adsorption pressure from the vacuum pump and clean residue from the upper molding using exhaustion pressure from the ventilator.

主权项

1. A substrate manufacturing facility comprising:
a lower molding plate including a plurality of grooves; a resin supply tray configured to provide resin powder for molding a substrate to the lower molding plate; and an upper molding plate configured to move the substrate over the lower molding plate, and to compress the substrate to the resin powder, wherein the upper molding plate includes multiple apertures that are densely formed on a side of the upper molding plate that contacts the substrate, and wherein the apertures have diameters that are smaller than diameters of the resin powder.