| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a structure for enabling transfer of a shape in a transfer part on a semiconductor substrate surface without immersing the semiconductor substrate in a solution. <P>SOLUTION: A semiconductor manufacturing apparatus transferring a shape in a transfer part on a semiconductor substrate surface drops a solution on the semiconductor substrate surface and horizontally moves the transfer part acting as catalyst such that a surface of the transfer part contacts the solution-dropped semiconductor substrate surface. <P>COPYRIGHT: (C)2013,JPO&INPIT |
