发明名称 SOLDER JET DEVICE AND SOLDERING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent gas leakage from a solder reservoir.SOLUTION: A solder jet device 2 is provided with a return tube 36 whose top end 36a is joined to a bottom face of a partitioning plate 31 to enclose the entire lower portion of a communicating opening 33. Thus, even when gas is supplied to a solder reservoir 5, the gas cannot enter the inside of the return tube 36 and the inside of the return tube 36 is filled with solder S. Accordingly, the gas does not enter the lower portion of the communicating opening 33 and gas leakage from a contact section between an on-off valve 24 and the communicating opening 33 can be prevented.</p>
申请公布号 JP2015026783(A) 申请公布日期 2015.02.05
申请号 JP20130156813 申请日期 2013.07.29
申请人 FUJITSU TEN LTD 发明人 HAYASHI HISAKI;YOSHIMURA KATSUHIRO
分类号 H05K3/34;B23K1/08 主分类号 H05K3/34
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