发明名称 |
ELECTROCONDUCTIVE-FILM-FORMING COMPOSITION AND METHOD FOR PRODUCING ELECTROCONDUCTIVE FILM |
摘要 |
The purpose of the present invention is to provide: an electroconductive-film-forming composition that can form an electroconductive film having excellent electroconductivity and few voids; and a method for producing an electroconductive film by using said composition. This electroconductive-film-forming composition comprises: copper particles having an average particle diameter of from 1 nm to 10 µm; copper oxide particles having an average particle diameter of from 1 to 500 nm; a reducing agent having a hydroxy group; a metal catalyst including a metal other than copper; and a solvent. The content of said copper oxide particles is from 50 to 300 mass% with respect to the content of said copper particles. The content of said reducing agent is from 100 to 800 mol% with respect to the content of said copper oxide particles. The content of said metal catalyst is 10 mass% or less with respect to the content of said copper oxide particles. |
申请公布号 |
WO2015015918(A1) |
申请公布日期 |
2015.02.05 |
申请号 |
WO2014JP65569 |
申请日期 |
2014.06.12 |
申请人 |
FUJIFILM CORPORATION |
发明人 |
TSUYAMA HIROAKI;WATANABE TORU;HAYATA YUUICHI |
分类号 |
C09D201/00;C09D1/00;C09D5/24;C09D7/12;H01B1/00;H01B1/22;H01B13/00;H05K1/09;H05K3/12 |
主分类号 |
C09D201/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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