| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a solder resist composition allowing prevention of reflectance reduction caused by discoloration and deterioration and having high reflectance and high resolution; and a printed wiring board obtained by forming a solder resist using the same. <P>SOLUTION: The solder resist composition contains (A) a carboxyl group-containing resin not having an aromatic ring, (B) a bisacylphosphine oxide photopolymerization initiator, (C) a monoacylphosphine oxide photopolymerization initiator, (D) a photopolymerizable monomer, (E) a rutile-type titanium oxide, (F) an epoxy compound, (G) an organic solvent and (H) an antioxidant, the antioxidant (H) being contained in an amount of 0.4 to 25 pts.mass based on 100 pts.mass of the carboxyl group-containing resin (A) not having an aromatic ring. <P>COPYRIGHT: (C)2012,JPO&INPIT |
