Lead, wiring member, package part, metal part provided with resin and resin-sealed semiconductor device, and methods for producing same

摘要

A semiconductor device and manufacturing method therefor, provided with the aims of constraining resin burr formation while having good electric connectivity and joining strength, and LED device, provided with the aim of improving adhesion between silicon resin and leads while having good luminescent characteristics.

主权项

1. A wiring member with metal leads having an organic film that is formed through self-assembly by an organic compound and that adheres to surfaces thereof, wherein
the organic compound has a structure such that the following (i) and (ii) are each arranged therein: (i) at an extremity of a principal chain, a first functional group that imparts bonding capability by which formation of any among metallic bonds, hydrogen bonds, and coordinate bonds via metal compounds, is made possible with respect to the leads, and (ii) at another extremity of the principal chain, a second functional group that causes or enhances resin hardening, the principal chain of the organic compound comprises: one or more chains selected from the group consisting of a methylene chain, a fluoromethylene chain, a siloxane chain, and a glycol chain; and one or more polar groups selected from the group consisting of hydroxyl radicals, ketone, thioketone, primary amine, secondary amine, and aromatic compounds, and the first functional group bonds with the leads.