发明名称 AUTOMATIC WIRE BONDING UNIT
摘要 PURPOSE:To make an accurate wire connection by discriminating the position of a straight line near the circumference of a semiconductor element by detecting the line by a photo sensor. CONSTITUTION:Photo sensors 33 and 34 are combined optically by mirror 35 and arranged at right angles. Beltlike square pattern 36 is provided near the circumference of element 31 and optically made different in contrast from the circumference. As a result, sensors can obtain as outputs (a) and (b) (b3) and (b4), and (a2) and (a3) in addition to outputs by element electrodes 37 and 38. Those are different from an output by an electrode pattern and constant unless the one-dimentional sensor is in the square pattern. For the purpose, center intervals T1 to T3, T4 and T5 are measured to find the combinational sum, so that since the magnification of optical system 32 and the size of square pattern 36 are previously determined, pattern 36 can be identified easily. In this way, the position is detected and a tool is moved to make a line connection. If there is a substitute for the square pattern near the element, the rise of the sensor is detected without any square pattern, thereby discriminating the position.
申请公布号 JPS54105469(A) 申请公布日期 1979.08.18
申请号 JP19780012859 申请日期 1978.02.06
申请人 发明人
分类号 H01L21/60 主分类号 H01L21/60
代理机构 代理人
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