| 发明名称 |
MECHANISMS FOR REMOVING DEBRIS FROM POLISHING PAD |
| 摘要 |
Embodiments of mechanisms for performing a chemical mechanical polishing (CMP) process are provided. A method for performing a CMP process includes polishing a wafer by using a polishing pad. The method also includes applying a cleaning liquid jet on the polishing pad to condition the polishing pad. A CMP system is also provided. |
| 申请公布号 |
US2015024661(A1) |
申请公布日期 |
2015.01.22 |
| 申请号 |
US201313944353 |
申请日期 |
2013.07.17 |
| 申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
PENG He-Hui;HUANG Fu-Ming;SUEN Shich-Chang;KUO Han-Hsin;TSAI Chi-Ming;CHEN Liang-Guang |
| 分类号 |
B24B53/017;H01L21/304 |
主分类号 |
B24B53/017 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for performing a chemical mechanical polishing (CMP) process, comprising:
polishing a wafer by using a polishing pad; and applying a cleaning liquid jet on the polishing pad to condition the polishing pad. |
| 地址 |
Hsin-Chu TW |
